| Layer |
Layer count |
12L |
| HDI |
AVAILABLE |
| Pattern |
Pattern width / spacing |
3.0mil / 3.0mil |
| Process capability |
Tolerance of Board Thickness |
3.0 mil |
| Layer to layer registation |
1.5mil |
| True position tolerance |
1.5mil |
| Min finished hole size |
6.0mil |
| Aspect ratio (H:T) |
0.15:10 |
| Copper plating uniformity |
R≦0.20mil |
| PAD to line spacing |
3.0mil |
| Min. S / M dam |
MIN:3.0mil |
| Legend width |
MIN:3.0mil |
| Heavy Copper (OZ) |
4 oZ |
| Surface finish |
Gold plating |
● |
| ENIG |
● |
| OSP |
● |
| HASL |
● |
| Carbon |
● |
| Immersion silver |
● |
| Immersion tin |
● |
| Resin plugging / cap plating |
● |