製程能力

PCB

Item Content Maximum
Layer Layer count 12L
HDI AVAILABLE
Pattern Pattern width / spacing 3.0mil / 3.0mil
Process capability Tolerance of Board Thickness 3.0 mil
Layer to layer registation 2.0 mil
True position tolerance 2.0 mil
Min finished hole size 0.15mm
Aspect ratio  (H:T) 0.15:10
Copper plating uniformity R≦0.2mil
PAD to line spacing  3.0mil
Min. S / M dam  MIN:3mil
Legend width MIN:3mil
Heavy Copper (OZ) 4oz
Surface finish Hard Gold plating
ENIG
OSP
HASL
Carbon
Immersion silver
Resin plugging / cap plating